Product outline
Japan Steel Works, Ltd. supply Vacuum & Pressure Lamination eqipment as called as MVLP in order to laminate films during manufacuring for electronic component and packaging substrate and semiconductor.
Solder resist fim and several lind of insulating fim and NCF for Flip chip and coating film are well-laminated by MVLP.
Benefit
- No Void
- High UPH
Application
- Solder Resist Film
- Insulating Film ( ABF etc )
- NCF
- Mold sheet
Product details
Equipment appearance
